EC2645ETTS-50.000M TR

EC2645ETTS-50.000M TR EC26 45 ET RoHS Pb TS -50.000M TR Series RoHS Compliant (Pb-free) 3.3V 4 Pad 5mm x 7mm Ceramic SMD LVCMOS Oscillator Packaging Options Tape and Reel Nominal Frequency 50.000MHz Frequency Tolerance/Stability ±50ppm Maximum Operating Temperature Range -40°C to +85°C Pin 1 Connection Tri-State (High Impedance) Duty Cycle 50 ±10(%) ELECTRICAL SPECIFICATIONS Nominal Frequency 50.000MHz Frequency Tolerance/Stability ±50ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Ouput Load Change, First Year Aging at 25°C, Shock, and Vibration) Operating Temperature Range -40°C to +85°C Supply Voltage 3.3Vdc ±10% Input Current 18mA Maximum Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH=-8mA) Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL=+8mA) Rise/Fall Time 3nSec Maximum (Measured at 20% to 80% of waveform) Duty Cycle 50 ±10(%) (Measured at 50% of waveform) Load Drive Capability 15pF Maximum Output Logic Type CMOS Pin 1 Connection Tri-State (High Impedance) Tri-State Input Voltage (Vih and Vil) +0.7Vdd Minimum to enable output, +0.3Vdd Maximum to disable output (High Impedance), No Connect to enable output. Standby Current 10µA Maximum (Disabled Output: High Impedance) RMS Phase Jitter 1pSec Maximum (12kHz to 20MHz offset frequency) Start Up Time 10mSec Maximum Storage Temperature Range -55°C to +125°C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS Fine Leak Test MIL-STD-883, Method 1014, Condition A Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-202, Method 213, Condition C Resistance to Soldering Heat MIL-STD-202, Method 210 Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010 Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/28/2009 | Page 1 of 6 EC2645ETTS-50.000M TR MECHANICAL DIMENSIONS (all dimensions in millimeters) 7.00 ±0.15 5.08 ±0.15 4 3 MARKING ORIENTATION 5.00 ±0.15 2.60 ±0.15 2 1 1.2 ±0.2 1.4 ±01 3.68 ±0.15 PIN CONNECTION 1 Tri-State 2 Ground/Case Ground 3 Output 4 Supply Voltage LINE MARKING 1 ECLIPTEK 2 50.000M 3 XXYZZ XX=Ecliptek Manufacturing Code Y=Last Digit of the Year ZZ=Week of the Year 1.6 +0.2/-0.5 Suggested Solder Pad Layout All Dimensions in Millimeters 2.0 (X4) 2.2 (X4) Solder Land (X4) 2.88 1.81 All Tolerances are ±0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/28/2009 | Page 2 of 6 EC2645ETTS-50.000M TR CLOCK OUTPUT TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% of Waveform OUTPUT DISABLE (HIGH IMPEDANCE STATE) 50% of Waveform 20% of Waveform VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 Test Circuit for CMOS Output Frequency Counter Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Probe (Note 2) Output + Voltage Meter _ 0.01µF (Note 1) 0.1µF (Note 1) Ground CL (Note 3) No Connect or Tri-State Note 1: An external 0.1µF low frequency tantalum bypass capacitor in parallel with a 0.01µF high frequency ceramic bypass capacitor close to the package ground and VDD pin is required. Note 2: A low capacitance (10Mohms), and high bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/28/2009 | Page 3 of 6 EC2645ETTS-50.000M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units 4.0 ±0.1 2.0 ±0.1 DIA 1.5 +0.1/-0.0 0.3 ±0.05 7.5 ±0.1 16 +0.3/-0.1 A0* 6.75 ±0.1 8.0 ±0.1 B0* K0* *Compliant to EIA 481A 1.5 MIN 22.4 MAX DIA 40 MIN Access Hole at Slot Location 360 MAX DIA 50 MIN DIA 20.2 MIN DIA 13.0 ±0.2 2.5 MIN Width 10.0 MIN Depth Tape slot in Core for Tape Start 16.4 +2/-0 www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/28/2009 | Page 4 of 6 EC2645ETTS-50.000M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25°C to Peak tP Time (t) High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 3°C/second Maximum 150°C 175°C 200°C 60 - 180 Seconds 3°C/second Maximum 217°C 60 - 150 Seconds 260°C Maximum for 10 Seconds Maximum 250°C +0/-5°C 20 - 40 seconds 6°C/second Maximum 8 minutes Maximum Level 1 Temperatures shown are applied to body of device. www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/28/2009 | Page 5 of 6 EC2645ETTS-50.000M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25°C to Peak tP Time (t) Low Temperature Infrared/Convection 240°C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5°C of actual peak (tp) Ramp-down Rate Time 25°C to Peak Temperature (t) Moisture Sensitivity Level Additional Notes 5°C/second Maximum N/A 150°C N/A 60 - 120 Seconds 5°C/second Maximum 150°C 200 Seconds Maximum 240°C Maximum 240°C Maximum 1 Time / 230°C Maximum 2 Times 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5°C/second Maximum N/A Level 1 Temperatures shown are applied to body of device. Low Temperature Manual Soldering 185°C Maximum for 10 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) High Temperature Manual Soldering 260°C Maximum for 5 seconds Maximum, 2 times Maximum. (Temperatures shown are applied to body of device.) www.ecliptek.com | Specification Subject to Change Without Notice | Rev T 8/28/2009 | Page 6 of 6